Patent Assignment
Reel/Frame 008408/0701
Assignment of Assignor's Interest
Recorded: 1997-03-12
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, PALDAL-GU SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip Having a Bonding Window Smaller Than a Wire Ball
Patent:
5,898,226 →
Application:
08/770,248 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.