Assignment of Assignor's Interest

Recorded: 1998-06-22 Pages: 3

Assignors

SUN, YONG KYUN

Executed: 1998-01-08

JANG, SAM BOK

Executed: 1998-01-07

JANG, DONG SUNG

Executed: 1998-01-07

KANG, HYCON GU

Executed: 1998-01-07

Assignee

SAMSUNG ELECTRONICS CO., LTD.

SUWON-CITY, 416, MAETAN-DONG, PALDAL-KU, KYUNGI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Wafer Sawing Apparatus Having Washing Solution Spray and Suction Devices for Debris Removal and Heat Dissipation

Patent: 6,105,567 →

Application: 09/019,121 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.