Assignment of Assignor's Interest

Recorded: 1998-03-31 Pages: 3

Assignors

KIM, TAE HYEONG

Executed: 1997-09-29

RHO, HEE SUN

Executed: 1997-09-29

CHO, IN SIK

Executed: 1997-09-29

YOO, GI SU

Executed: 1997-09-29

LEE, SANG HYEOP

Executed: 1997-09-29

Assignee

SAMSUNG ELECTRONICS CO., LTD.

416, MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Semiconductor Device Packages Having Dummy Block Leads and the Bars with Extended Portions to Prevent Formation of Air Traps in the Encapsulate

Patent: 5,932,923 →

Application: 08/943,129 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.