Patent Assignment
Reel/Frame 006609/0190
Assignment of Assignor's Interest
Recorded: 1993-06-29
Pages: 2
Assignor
KRAUSE, DAVID A.
Executed: 1993-06-24
Assignee
MITSUBISHI SEMICONDUCTOR AMERICA, INC.
THREE DIAMOND LANE, DURHAM, NORTH CAROLINA, 27704
Covered Property
(1)
Method of and System for Laying Out Bus Cells on an Integrated Circuit Chip
Patent:
5,440,497 →
Application:
08/082,869 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 22, 1999
From: MITSUBISHI SEMICONDUCTOR AMERICA, INC.
To: MITSUBISHI ELECTRONICS AMERICA, INC.
Reel/Frame 009958/0191 →
Assignment of Assignor's Interest
Nov 7, 2008
From: MITSUBISHI ELECTRONICS AMERICA, INC.
To: MITSUBISHI ELECTRIC & ELECTRONICS USA, INC.
Reel/Frame 021794/0916 →
Assignment of Assignor's Interest
Nov 24, 2008
From: MITSUBISHI ELECTRIC & ELECTRONICS USA, INC.
To: HITACHI SEMICONDUCTOR (AMERICA) INC.
Reel/Frame 021876/0537 →
Change of Name
Nov 24, 2008
From: HITACHI SEMICONDUCTOR (AMERICA) INC.
To: RENESAS TECHNOLOGY AMERICA, INC.
Reel/Frame 021876/0556 →
Merger
May 13, 2010
From: RENESAS TECHNOLOGY AMERICA, INC.
To: RENESAS ELECTRONICS AMERICA INC.
Reel/Frame 024380/0300 →