IP Library › Assignment 009958/0191
Patent Assignment
Reel/Frame 009958/0191

Assignment of Assignor's Interest

Recorded: 1999-01-22 Pages: 5
Assignor
Assignee
MITSUBISHI ELECTRONICS AMERICA, INC.
1050 EAST ARQUES AVENUE, SUNNYVALE, CALIFORNIA, 94086
Covered Properties (51)
Array Layout Structure for Implementing Large High-Density Address Decoders for Gate Array Memories
Patent: 5,182,727 →
Application: 07/773,827 →
Socket for Mounting a Printed Circuit Board Module
Patent: 349,886 →
Application: 07/913,543 →
Combined Light Beam and Ultrasonic Transducer Safety Sensing System
Patent: 5,280,622 →
Application: 07/914,341 →
Method and Apparatus for Determining Error Location
Patent: 5,463,642 →
Application: 08/082,867 →
Method of and System for Laying Out Bus Cells on an Integrated Circuit Chip
Patent: 5,440,497 →
Application: 08/082,869 →
Parallel Encoding Apparatus and Method Implementing Cyclic Redundancy Check and Reed-Solomon Codes
Patent: 5,383,204 →
Application: 08/082,870 →
Apparatus for Correcting Errors in Optical Disks
Patent: 5,446,745 →
Application: 08/150,897 →
General Purpose Data Communications Protocol Converter
Patent: 6,208,904 →
Application: 08/190,389 →
Finite Field Polynomial Processing Module for Error Control Coding
Patent: 5,642,367 →
Application: 08/192,909 →
Vertical Detail Enhancement with Stepped Return Coring
Patent: 5,446,503 →
Application: 08/225,690 →
Cmos Level Shifter with Feedforward Control to Prevent Latching in a Wrong Logic State
Patent: 5,486,785 →
Application: 08/316,462 →
Learning Method for Neural Network Having Discrete Interconnection Strengths
Patent: 5,644,681 →
Application: 08/363,597 →
Hazardous Material Protection Suit with Carrying Handles
Patent: 5,632,043 →
Application: 08/421,348 →
Hierarchical Floorplanner for Gate Array Design Layout
Patent: 5,513,119 →
Application: 08/493,016 →
Carriers for Ic Packages
Patent: 5,644,473 →
Application: 08/517,122 →
Multiple Device Carrier
Patent: 5,664,681 →
Application: 08/518,939 →
High Bit Rate Start Code Searching and Detecting Circuit and Method
Patent: 5,727,036 →
Application: 08/561,756 →
Low Power High Speed Mpeg Video Variable Length Decoder
Patent: 5,767,799 →
Application: 08/567,592 →
Integrated Circuit Package Assembly
Patent: 5,623,395 →
Application: 08/572,922 →
Mpeg Encoding and Decoding System for Multimedia Applications
Patent: 5,845,083 →
Application: 08/612,512 →
Automated Test Fixture Control System
Patent: 5,777,873 →
Application: 08/639,817 →
System for Ultrasonic Removal of Air Bubbles from the Surface of an Electroplated Article
Patent: 5,653,860 →
Application: 08/641,792 →
Shared Dram I/O Databus for High Speed Operation
Patent: 5,680,365 →
Application: 08/648,795 →
Automatic Software License Manager
Patent: 5,742,757 →
Application: 08/655,132 →
Buffer with Drive Characteristics Controllable by Software
Patent: 5,727,166 →
Application: 08/659,599 →
Self Tightening Clamp
Patent: 5,696,328 →
Application: 08/720,498 →
Method and Apparatus for Controlling Plating Thickness of a Workpiece
Patent: 5,788,829 →
Application: 08/732,654 →
Method and Apparatus Using an Anode Basket for Electroplating a Workpiece
Patent: 5,776,327 →
Application: 08/732,655 →
Asymmetrical Vertical Lightly Doped Drain Transistor and Method of Forming the Same
Patent: 5,834,810 →
Application: 08/733,309 →
Symmetrical Vertical Lightly Doped Drain Transistor and Method of Forming the Same
Patent: 5,814,861 →
Application: 08/733,311 →
Field Effect Transistor Having an Arched Gate and Manufacturing Method Thereof
Patent: 5,821,573 →
Application: 08/733,312 →
Lead Frame Dryer
Patent: 5,737,846 →
Application: 08/755,049 →
Micro Rom Testing System Using Micro Rom Timing Circuits for Testing Operations
Patent: 5,793,687 →
Application: 08/760,007 →
Anode Basket for Controlling Plating Thickness Distribution
Patent: 5,744,013 →
Application: 08/764,807 →
High-Speed Main Amplifier with Reduced Access and Output Disable Time Periods
Patent: 5,798,972 →
Application: 08/767,135 →
Latched Dram Write Bus for Quickly Clearing Dram Array with Minimum Power Usage
Patent: 5,784,329 →
Application: 08/781,388 →
Carrier Cart
Patent: 5,779,428 →
Application: 08/783,800 →
Spacer and Shim Assembly for Fluid Powered Diaphragm Pumps
Patent: 5,851,109 →
Application: 08/786,904 →
Integrated Circuit Package Assembly
Patent: 5,790,381 →
Application: 08/808,406 →
Automatically Aligning Tool for Uniformly Applying a Controlled Force to an Object
Patent: 5,767,414 →
Application: 08/810,787 →
Dma Controller with Semaphore Communication Protocol
Patent: 6,055,583 →
Application: 08/828,780 →
Three-Transistor Static Storage Cell
Patent: 5,838,606 →
Application: 08/845,840 →
Protocol Converter Controller Having Distributed Architecture
Patent: 6,070,196 →
Application: 08/857,256 →
Ram Having Multiple Ports Sharing Common Memory Locations
Patent: 5,946,262 →
Application: 08/954,628 →
Grounded Packaged Semiconductor Structure and Manufacturing Method Therefor
Patent: 6,140,581 →
Application: 08/984,076 →
Multi-Port Ram Having Functionally Identical Ports
Patent: 6,167,487 →
Application: 09/006,190 →
Muti-Port Memory Devive Having Masking Registers
Patent: 6,101,579 →
Application: 09/006,191 →
Independent Chip Select for Sram and Dram in a Multi-Port Ram
Patent: 6,157,990 →
Application: 09/012,460 →
Addressing System in a Multi-Port Ram Having Main and Cache Memories
Patent: 6,088,760 →
Application: 09/018,343 →
Dual Clocking Scheme in a Multi-Port Ram
Patent: 5,959,937 →
Application: 09/024,559 →
Cassette Gripper
Patent: 372,849 →
Application: 29/034,981 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Dec 6, 1991
From: MC FALLS, CHARLES S., JR.; SPROULE, PATRICK A.; MULLINS, MICHAEL A.
To: MITSUBISHI SEMICONDUCTOR AMERICA, INC.
Reel/Frame 005933/0796 →
Assignment of Assignors Interest. Jul 15, 1992
From: DEROUICHE, NOUR E.
To: MITSUBISHI SEMICONDUCTOR AMERICA, INC.
Reel/Frame 006207/0096 →
Assignment of Assignors Interest. Jul 17, 1992
From: TINO, CHRISTOPHER J.
To: MITSUBISHI SEMICONDUCTOR AMERICA, INC., A CORPORATON OF DELAWARE
Reel/Frame 006189/0846 →
Assignment of Assignor's Interest Jun 29, 1993
From: GIBBS, VICKIE L.; KAO, ROM-SHEN
To: MITSUBISHI SEMICONDUCTOR AMERICA, INC.
Reel/Frame 006620/0192 →
Assignment of Assignor's Interest Jun 29, 1993
From: GIBBS, VICKIE L.; KAO, ROM-SHEN
To: MITSUBISHI SEMICONDUCTOR AMERICA, INC.
Reel/Frame 006606/0657 →
Assignment of Assignor's Interest Jun 29, 1993
From: KRAUSE, DAVID A.
To: MITSUBISHI SEMICONDUCTOR AMERICA, INC.
Reel/Frame 006609/0190 →
Assignment of Assignor's Interest Nov 12, 1993
From: GIBBS, VICKIE L.
To: MITSUBISHI SEMICONDUCTOR AMERICA, LTD.
Reel/Frame 006780/0452 →
Assignment of Assignor's Interest Feb 2, 1994
From: MULLEN, ROBERT E., JR.
To: MITSUBISHI SEMICONDUCTOR AMERICA, INC.
Reel/Frame 006882/0758 →
Assignment of Assignor's Interest Feb 7, 1994
From: KAO, ROM SEHN
To: MITSUBISHI SEMICONDUCTOR AMERICA, INC.
Reel/Frame 006872/0158 →
Assignment of Assignor's Interest Sep 30, 1994
From: BLANKENSHIP, DENNIS R.
To: MITSUBISHI SEMICONDUCTOR AMERICA, INC. THREE DIAMOND LANE
Reel/Frame 007157/0458 →
Assignment of Assignor's Interest Apr 13, 1995
From: TINO, CHRISTOPHER J.
To: MITSUBISHI SEMICONDUCTOR AMERICA, INC.
Reel/Frame 007450/0667 →
Assignment of Assignor's Interest May 8, 1995
From: SPROULE, PATRICK
To: MITSUBISHI SEMICONDUCTOR AMERICA, INC.
Reel/Frame 007476/0652 →
Assignment of Assignor's Interest Aug 21, 1995
From: DEROUICHE, NOUR EDDINE
To: MITSUBISHI SEMICONDUCTOR AMERICA, INC.
Reel/Frame 007652/0338 →
Assignment of Assignor's Interest Aug 24, 1995
From: DEROUICHE, NOUR EDDINE
To: MITSUBISHI SEMICONDUCTOR AMERICA, INC.
Reel/Frame 007679/0287 →
Assignment of Assignor's Interest Nov 22, 1995
From: MAERTENS, JAMES N.
To: MITSUBISHI SEMICONDUCTOR AMERICA, INC.
Reel/Frame 007791/0775 →
Assignment of Assignor's Interest Dec 5, 1995
From: MAERTENS, JAMES N.; HAN, KYUNG IN
To: MITSUBISHI SEMICONDUCTOR AMERICA, INC.
Reel/Frame 007997/0651 →
Assignment of Assignor's Interest Dec 15, 1995
From: DEROUICHE, NOUR EDDINE; JEWLER, SCOTT
To: MITSUBISHI SEMICONDUCTOR AMERICA,, INC.
Reel/Frame 007816/0090 →
Assignment of Assignor's Interest Mar 7, 1996
From: HAMADANI, MEHRDAD; KAO, ROM-SHEN
To: MITSUBISHI SEMICONDUCTOR AMERICA, INC.
Reel/Frame 007903/0741 →
Assignment of Assignor's Interest Apr 29, 1996
From: COX, JOHN; WARREN, WAITE R., JR.
To: MITSUBISHI SEMICONDUCTOR AMERICA, INC.
Reel/Frame 007972/0658 →
Assignment of Assignor's Interest May 2, 1996
From: NICHOLLS, LOUIS W.; WARREN, WAITE R., JR.
To: MITSUBISHI SEMICONDUCTOR AMERICA, INC.
Reel/Frame 008008/0090 →
Assignment of Assignor's Interest May 16, 1996
From: BLANKENSHIP, DENNIS R.
To: MITSUBISHI SEMICONDUCTOR AMERICA, INC.
Reel/Frame 008026/0350 →
Assignment of Assignor's Interest May 30, 1996
From: HUFFMAN, WARD; HAMADANI, MEHRDAD
To: MITSUBISHI SEMICONDUCTOR AMERICA, INC.
Reel/Frame 008025/0093 →
Assignment of Assignor's Interest Mar 24, 1997
From: COIERA, ENRICO WILLIAM; LEWIS, SIMON CHARLES ROGER
To: HEWLETT-PACKARD LABORATORIES
Reel/Frame 008422/0244 →
Assignment of Assignor's Interest Nov 7, 2008
From: MITSUBISHI ELECTRONICS AMERICA, INC.
To: MITSUBISHI ELECTRIC & ELECTRONICS USA, INC.
Reel/Frame 021794/0916 →
Change of Name Nov 24, 2008
From: HITACHI SEMICONDUCTOR (AMERICA) INC.
To: RENESAS TECHNOLOGY AMERICA, INC.
Reel/Frame 021876/0556 →