Patent Assignment
Reel/Frame 007816/0090
Assignment of Assignor's Interest
Recorded: 1995-12-15
Pages: 3
Assignee
MITSUBISHI SEMICONDUCTOR AMERICA,, INC.
THREE DIAMOND LANE, DURHAM, NORTH CAROLINA, 27704
Covered Property
(1)
Integrated Circuit Package Assembly
Patent:
5,623,395 →
Application:
08/572,922 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.