Patent Assignment
Reel/Frame 006648/0797
Assignment of Assignor's Interest
Recorded: 1993-07-30
Pages: 2
Assignors
MOCHIDA, TOORU
Executed: 1993-07-13
TERAKADO, YOSHIMITSU
Executed: 1993-07-13
HAYASHI, HIJIRI
Executed: 1993-07-13
Assignee
KABUSHIKI KAISHA SHINKAWA
2-51-1 INDADAIRA MUSASHIMURAYAMA-SHI, TOKYO, JAPAN
Covered Property
(1)
Motor Control Circuit for a Wire Bonding Apparatus
Patent:
5,485,063 →
Application:
08/099,623 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.