Patent Assignment
Reel/Frame 006721/0078
Assignment of Assignor's Interest
Recorded: 1993-10-08
Pages: 3
Assignors
WATANABE, MINEO
Executed: 1993-09-20
HARADA, HITOSHI
Executed: 1993-09-20
TAKEMURA, MASANORI
Executed: 1993-09-20
Assignees
MITSUBISHI MATERIALS CORPORATION
5-1, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
MITSUBISHI MATERIALS SILICON CORPORATION
8-16, IWAMOTO-CHO 3-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Manufacturing Wafer
Patent:
5,429,711 →
Application:
08/104,323 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Apr 5, 2011
From: MITSUBISHI MATERIALS SILICON CORPORATION
To: SUMITOMO MITSUBISHI SILICON CORPORATION
Reel/Frame 026074/0552 →
Change of Name
Apr 7, 2011
From: SUMITOMO MITSUBISHI SILICON CORPORATION
To: SUMCO CORPORATION
Reel/Frame 026100/0718 →
Assignment of Assignor's Interest
Oct 5, 2011
From: MITSUBISHE MATERIALS CORPORATION
To: SUMCO CORPORATION
Reel/Frame 027021/0207 →