Assignment of Assignor's Interest

Recorded: 1993-12-10 Pages: 2

Assignor

ISOBE, AKIRA

Executed: 1993-11-30

Assignee

NEC CORPORATION

7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Method for Fabricating Multi-Level Interconnection Structure for Semiconductor Device

Patent: 5,677,239 →

Application: 08/164,579 →

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.