Patent Assignment
Reel/Frame 006927/0091
Assignment of Assignor's Interest
Recorded: 1994-03-17
Pages: 2
Assignor
TSUDA, HIROSHI
Executed: 1994-03-01
Assignee
NEC CORPORATION, A CORP. OF JAPAN
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device with Multi-Layered Heat-Resistive Electrode in Titanium-Titanium Nitride-Platinum-Gold System
Patent:
5,426,331 →
Application:
08/210,176 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 1, 2002
From: NEC CORPORATION
To: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Reel/Frame 013343/0674 →
Assignment of Assignor's Interest
Apr 4, 2006
From: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017422/0528 →
Change of Name
Oct 18, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025149/0840 →