Patent Assignment
Reel/Frame 007001/0942
Assignment of Assignor's Interest
Recorded: 1994-05-09
Pages: 7
Assignors
FRANK, AARON LEONARD
Executed: 1994-04-11
IBIDUNNI, AJIBOLA OLUTOYIN
Executed: 1994-04-20
JOHNSON, DOUGLAS BRADFORD
Executed: 1994-04-22
KRAUSE, DENNIS LYLE
Executed: 1994-04-11
NGUYEN, TRAC
Executed: 1994-04-12
Assignee
AT&T CORP.
32 AVENUE OF THE AMERICAS, NEW YORK, NEW YORK, 10013-2412
Covered Property
(1)
Metallization for Polymer-Dielectric Multichip Modules Including a Ti/Pd Alloy Layer
Patent:
5,466,972 →
Application:
08/239,797 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Release of Security Interest
May 16, 2003
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: HERCULES INCORPORATED; HERCULES CREDIT, INC.; HERCULES FLAVOR, INC.; WSP, INC.
Reel/Frame 013653/0919 →
Patent Security Agreement
May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
Termination and Release of Security Interest in Patent Rights (Releases Rf 032856-0031)
Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →