Assignment of Assignor's Interest

Recorded: 1994-12-23 Pages: 2

Assignors

KUSUDA, TATSUFUMI

Executed: 1994-11-28

KOUNO, MOTOHIRO

Executed: 1994-11-28

NAKATANI, IKUYOSHI

Executed: 1994-11-28

HIRAE, SADAO

Executed: 1994-12-05

Assignee

DAINIPPON SCREEN MFG. CO., LTD.

1-1, TENJINKITAMACHI, TERANOUCHI-AGARU 4-CHOME HORIKAWA-DORI, KAMIKYO-KU, KYOTO, JAPAN CORPORATION OF JAPAN, KYOTO,, JAPAN

Covered Property (1)

Method and Apparatus for Measuring Insulation Film Thickness of Semiconductor Wafer

Patent: 5,568,252 →

Application: 08/363,535 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.