Patent Assignment
Reel/Frame 007742/0147
Assignment of Assignor's Interest
Recorded: 1995-10-30
Pages: 4
Assignors
SARMA, DWADASI H. R.
Executed: 1995-09-14
PASZKIET, CHRISTINE A.
Executed: 1995-09-14
OREM, JAMES C.
Executed: 1995-09-19
NEEDES, CHRISTOPHER R.
Executed: 1995-10-06
Assignee
DELCO ELECTRONICS CORPORATION
MAIL STOP D-32, ERC BUILDING, KOKOMO, INDIANA, 46904
Covered Property
(1)
Solder Process for Enhancing Reliability of Multilayer Hybrid Circuits
Patent:
5,803,343 →
Application:
08/550,321 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 2, 2009
From: DELCO ELECTRONICS CORPORATION
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 023337/0262 →
Assignment of Assignor's Interest
Jun 17, 2011
From: DELPHI TECHNOLOGIES, INC.
To: PEAKS ISLAND LLC
Reel/Frame 026459/0909 →
Assignment of Assignor's Interest
May 2, 2012
From: PEAKS ISLAND LLC
To: RPX CORPORATION
Reel/Frame 028146/0045 →
Assignment of Assignor's Interest
Aug 1, 2013
From: RPX CORPORATION
To: HTC CORPORATION
Reel/Frame 030935/0943 →