Patent Assignment
Reel/Frame 026459/0909
Assignment of Assignor's Interest
Recorded: 2011-06-17
Received: 2011-06-17
Pages: 5
Assignor
DELPHI TECHNOLOGIES, INC.
Executed: 2011-01-13
Assignee
PEAKS ISLAND LLC
874 WALKER ROAD, SUITE C, C/O UNITED CORPORATE SERVICES, INC., DOVER, DE, 19904, UNITED STATES
Covered Properties
(30)
Embedded Resistor and Capacitor Circuit and Method of Fabricating Same
Application:
11/891,067 →
Compression Connection for Vertical Ic Packages
Application:
11/712,718 →
Method of Analyzing Electrical Connection and Test System
Application:
11/586,456 →
Electronics Enclosure and Method of Fabricating an Electronics Enclosure
Application:
11/533,494 →
Electronic Enclosure with Continuous Ground Contact Surface
Application:
11/523,985 →
Manufacturing Method for a Leadless Multi-Chip Electronic Module
Application:
11/471,869 →
Electronic Package and Circuit Board Having Segmented Contact Pads
Application:
11/213,141 →
Surface Mount Connector
Application:
11/191,864 →
Sealed Electronic Module with Seal-in-Place Connector Header
Application:
11/053,129 →
Discrete Circuit for Driving Field Effect Transistors
Application:
10/940,872 →
Multi-Path Bar Bond Connector for an Integrated Circuit Assembly
Application:
10/919,864 →
Technique for Calibrating a Current Control Circuit
Application:
10/828,848 →
Technique for Connector to Printed Circuit Board Decoupling to Eliminate Flexure
Application:
10/784,350 →
Circuit Board with Localized Stiffener for Enhanced Circuit Component Reliability
Application:
10/717,839 →
Electronic Module with Removable Circuitry and Method Therefor
Application:
10/707,004 →
Fabrication of Thick Film Electrical Components
Application:
10/639,794 →
Technique for Surface Mounting Electrical Components to a Circuit Board
Application:
10/628,823 →
Electronic Package Having Controlled Height Stand-Off Solder Joint
Application:
10/616,617 →
Circuitry for Measuring Mechanical Stress Impressed on a Printed Circuit Board
Application:
10/408,937 →
Multi-Chip Module and Method of Forming
Application:
10/321,900 →
Twisted Flat Electrical Terminal
Application:
10/268,327 →
Leach-Resistant Solder Alloys for Silver-Based Thick-Film Conductors
Application:
10/252,502 →
Lead Protusion Tester
Application:
10/230,021 →
Method of Mounting a Leadless Package and Structure Therefor
Application:
10/177,940 →
Automotive Electronics Control Module Enclosure
Application:
10/175,094 →
Integrated Circuit Assembly with Bar Bond Attachment
Application:
10/124,782 →
Title Not Available
Application:
09/851,393 →
High Density Wirebond Connector Assembly
Application:
09/850,626 →
Technique for Surface Mounting Electrical Components to a Circuit Board
Application:
09/844,575 →
Transceiver in a Two-Way Satellite System
Application:
09/790,379 →