Compression connection for vertical IC packages
View Patent ↗An improved vertical integrated circuit device package that eliminates or reduces the need for wire bond connections and/or solder connections is provided. The package includes a vertical device having electrodes on opposite surfaces, and a compressed spring member that is used to establish compression electrical connections between the electrodes and corresponding electrically conductive elements.
1. An integrated circuit package comprising:
an integrated circuit device having a first electrical contact on a first side of the integrated circuit device and a second electrical contact on an opposite second side of integrated circuit device;
a printed circuit board having a first side and an opposite second side, a first electrical contact and a second electrical contact on the first side of the printed circuit board;
an electrically conductive element electrically connecting the first electrical contact on the integrated circuit device with the first electrical contact on the printed circuit board;
the second electrical contact on the integrated circuit device positioned immediately overlying the second electrical contact on the printed circuit board;
a first spring member under compression urging the first electrical contact on the integrated circuit device against a first section of the electrically conductive element to establish a first compression electrical connection, and urging the second electrical contact on the integrated circuit device against the second electrical contact on the printed circuit board to establish a second compression electrical connection; and
a second spring member under compression urging a second section of the electrically conductive element against the first electrical contact on the printed circuit board to establish a third compression electrical connection.
2. The package of claim 1 , wherein the integrated circuit device is a MOSFET.
3. The package of claim 1 , wherein the integrated circuit device is an IGBT.
4. The package of claim 1 , further comprising a second circuit device having electrodes on opposite surfaces, and a third spring member under compression urging each of the electrodes in the second circuit device against a corresponding electrically conductive element to establish compression electrical connections between each of the electrodes of the second circuit device and the corresponding electrically conductive elements.
5. The package of claim 4 , wherein the second circuit device is a diode.
6. The package of claim 1 , wherein the spring members are comprised of an elastomeric material.
7. The package of claim 1 , wherein the spring members are metal coil springs or metal leaf springs.