IP Library Granted Patent US 6,897,378
Granted Patent B2
US 6,897,378 · App. 10/628,823 · Granted May 24, 2005

Technique for surface mounting electrical components to a circuit board

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Quick Facts
Patent No.
US 6,897,378
App. No.
10/628,823
Granted
May 24, 2005
Kind
B2
Abstract

A technique for mounting an electrical component to a circuit board includes deforming each of a number of electrical terminals extending from the electrical component to form a mounting portion and a tip portion extending away from the mounting portion. The circuit board defines a number of bores extending therein from a first surface to a second opposite surface, and the electrical component is mounted to the circuit board with the mounting portion of each of the number of electrical terminals supporting the component against the first surface of the circuit board with each of the tip portions extending into separate ones of the number of bores. The mounting portion of each of the electrical terminals is mechanically and electrically affixed to corresponding electrically conductive pads to thereby surface mount the electrical component to the circuit board. The disclosed technique is particularly advantageous for surface mounting display units.

Claims (10)

1. A circuit assembly comprising:

an electrical component having a first electrical terminal extending from one side and a second electrical terminal extending from an opposite side, each said electrical terminal comprising a downward portion adjacent the component, a mounting portion extending from the downward portion outward relative to the component, and a tip portion extending downward from the mounting portion spaced apart from the downward portion; and

a circuit board defining a first bore and a second bore extending from a first surface toward a second opposite surface thereof, a first electrically conductive pad about the first bore and a second electrically conductive pad about the second bore, said electrical component mounted to said circuit board such that the tip portion of the first electrical terminal is received in the first bore and the mounting portion of the first electrical terminal is bonded to the first electrically conductive pad, and the tip portion of the second electrical terminal is received in the second bore and the mounting portion of the second electrical terminal is bonded to the second electrically conductive pad,

wherein the first and second bores and the first and second conductive pads are disposed outboard relative to the component.

2. The circuit assembly of claim 1 wherein each said mounting portion of said electrical terminal is soldered to said electrically conductive pad.

3. The circuit assembly of claim 1 wherein each said bore extends completely through said circuit board from said first surface to said second opposite surface.

4. The circuit assembly of claim 1 wherein said electrical component defines a viewing surface;

and wherein said mounting portion of each said electrical terminal is disposed substantially parallel with said viewing surface of said electrical component.

5. The circuit assembly of claim 4 wherein said tip portion of each said electrical terminal is disposed substantially perpendicularly away from said mounting portion.

6. The circuit assembly of claim 1 wherein said electrical component is a display unit.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 2, 2012
From: PEAKS ISLAND LLC
To: RPX CORPORATION
Reel/Frame 028146/0045 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 17, 2011
From: DELPHI TECHNOLOGIES, INC.
To: PEAKS ISLAND LLC
Reel/Frame 026459/0909 →
RELEASE OF SECURITY AGREEMENT Recorded Apr 14, 2008
From: JPMORGAN CHASE BANK, N.A.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 020808/0583 →
SECURITY AGREEMENT Recorded Jul 7, 2005
From: DELPHI TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 016237/0402 →