Patent Assignment
Reel/Frame 007966/0188
Assignment of Assignor's Interest
Recorded: 1995-12-04
Pages: 2
Assignor
HERMANSEN, RALPH D.
Executed: 1995-11-22
Assignee
HUGHES ELECTRONICS
7200 HUGHES TERRACE, LOS ANGELES, CALIFORNIA, 90045
Covered Property
(1)
Hot Melt Epoxy Encapsulation Material
Patent:
5,708,056 →
Application:
08/566,519 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 4, 1995
From: LINDLEY, THERESA RENEE; WENNBERG, SAMUEL R.; SANFTLEBEN, HENRY MORRIS; ROSSON, JAMES M.
To: DELCO ELECTRONICS CORPORATION
Reel/Frame 007970/0279 →
Assignment of Assignor's Interest
Oct 2, 2009
From: DELCO ELECTRONICS CORPORATION
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 023337/0262 →