IP Library Assignment 007970/0279
Patent Assignment
Reel/Frame 007970/0279

Assignment of Assignor's Interest

Recorded: 1995-12-04 Pages: 4
Assignors
LINDLEY, THERESA RENEE
Executed: 1995-11-28
WENNBERG, SAMUEL R.
Executed: 1995-11-28
SANFTLEBEN, HENRY MORRIS
Executed: 1995-11-27
ROSSON, JAMES M.
Executed: 1995-11-27
Assignee
DELCO ELECTRONICS CORPORATION
P.O. BOX 9005, ERC BLDG. - M.S. D-32, KOKOMO, INDIANA, 46904
Covered Property (1)
Hot Melt Epoxy Encapsulation Material
Patent: 5,708,056 →
Application: 08/566,519 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 4, 1995
From: HERMANSEN, RALPH D.
To: HUGHES ELECTRONICS
Reel/Frame 007966/0188 →
Assignment of Assignor's Interest Oct 2, 2009
From: DELCO ELECTRONICS CORPORATION
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 023337/0262 →