Patent Assignment
Reel/Frame 007973/0301
Assignment of Assignor's Interest
Recorded: 1996-06-17
Pages: 3
Assignors
YATSUGAKE, YASUO
Executed: 1996-03-19
OKAWA, TAKASHI
Executed: 1996-03-19
MIZUTANI, NORIHIKO
Executed: 1996-03-19
IIZUKA, SHIGEHARU
Executed: 1996-03-19
Assignee
HITACHI ELECTRONICS ENGINEERING CO., LTD.
16-3, HIGASHI 3-CHOME, SHIBUYA-KU, TOKYO, JAPAN
Covered Property
(1)
Inspection Method and Device of Wafer Surface
Patent:
5,903,342 →
Application:
08/629,266 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Sep 30, 2004
From: HITACHI ELECTRONICS ENGINEERING CO., LTD.
To: HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO., LTD.
Reel/Frame 015201/0763 →
Assignment of Assignor's Interest
Jul 28, 2005
From: HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO., LTD.
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 016570/0926 →