Granted Patent
Utility
US 5,903,342 · App. 08/629,266
Inspection method and device of wafer surface
Inventors:
Yasuo Yatsugake, Takashi Okawa, Norihiko Mizutani, Shigeharu Iizuka
Patented Case
View Patent ↗
Granted: May 11, 1999
Filed: Apr 8, 1996
Inventors
Yasuo Yatsugake
Takashi Okawa
Norihiko Mizutani
Shigeharu Iizuka
Assignee (at issue)
Hitachi Electronics Engineering Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.