Patent Assignment
Reel/Frame 007973/0518
Assignment of Assignor's Interest
Recorded: 1996-04-24
Pages: 2
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device with Increased Multi-Bumps and Adhered Multilayered Insulating Films and Method for Installing Same
Patent:
5,757,078 →
Application:
08/637,281 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.