Patent Assignment
Reel/Frame 007975/0313
Assignment of Assignor's Interest
Recorded: 1996-05-02
Pages: 3
Assignor
WARREN, ROBERT W.
Executed: 1996-04-22
Assignee
HUGHES ELECTRONICS
BLDG. CO1, M/S A126, 7200 HUGHES TERRACE, LOS ANGELES, CALIFORNIA, 90045
Covered Property
(1)
Top of Die Chip-on-Board Encapsulation
Patent:
5,951,813 →
Application:
08/643,036 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Release of Security Interest in Patents
Oct 1, 2010
From: WELLS FARGO BANK, AS SUCCESSOR-BY-MERGER TO WACHOVIA BANK, NATIONAL ASSOCIATION, IN ITS CAPACITY AS AGENT
To: INNOPHOS, INC.
Reel/Frame 025066/0911 →
Assignment of Assignor's Interest
Oct 12, 2012
From: RAYTHEON COMPANY
To: OL SECURITY LIMITED LIABILITY COMPANY
Reel/Frame 029117/0335 →
Merger
Apr 8, 2013
From: HE HOLDINGS, INC. D/B/A HUGHES ELECTRONICS
To: RAYTHEON COMPANY
Reel/Frame 030173/0928 →