Patent Assignment
Reel/Frame 008172/0005
Assignment of Assignor's Interest
Recorded: 1996-10-07
Pages: 2
Assignor
RYU, JAE-CHUL
Executed: 1996-08-27
Assignee
SAMSUNG AEROSPACE INDUSTRIES, LTD
28 SUNGJU-DONG, CHANGWON-CITY, KYONGSANGNAM-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multi-Layered Circuit Substrate and Manufacturing Method Thereof
Patent:
5,747,222 →
Application:
08/712,117 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.