Patent Assignment
Reel/Frame 033327/0442
Assignment of Assignor's Interest
Recorded: 2014-07-16
Pages: 4
Assignor
SAMSUNG TECHWIN CO., LTD.
Executed: 2014-04-30
Assignee
MDS CO. LTD.
84, JEONGDONG-RO, SEONGSAN-GU,, GYEONGSANGNAM-DO,, CHANGWON-SI, 641-120, KOREA, REPUBLIC OF
Covered Properties
(42)
Lead Frame of a Semiconductor Device and a Method for Designing It
Patent:
5,808,355 →
Application:
08/658,126 →
Multi-Layered Circuit Substrate and Manufacturing Method Thereof
Patent:
5,747,222 →
Application:
08/712,117 →
Lead Frame Taping Apparatus and Taping Method
Patent:
5,833,783 →
Application:
08/736,749 →
Semiconductor Lead Frame
Patent:
5,767,574 →
Application:
08/792,211 →
Lead Frame for Semiconductor Device
Patent:
5,958,607 →
Application:
08/823,691 →
Method for Lead Frame Etching
Patent:
5,945,259 →
Application:
09/025,260 →
Multi-Layer Plated Lead Frame
Patent:
6,150,711 →
Application:
09/026,509 →
Semiconductor Lead Frame Having Multi-Layered Plating Layer Including Copper-Nickel Plating Layer
Patent:
6,037,653 →
Application:
09/046,656 →
Lead Frame Having a Ni-Mn Alloy Layer and a Pd Layer
Patent:
5,977,620 →
Application:
09/081,436 →
Lead Frame for Semiconductor Package and Lead Frame Plating Method
Patent:
6,150,713 →
Application:
09/260,471 →
Lead Frame and Method for Plating the Same
Patent:
6,469,386 →
Application:
09/492,402 →
Lead Frame and Method of Manufacturing the Lead Frame
Flexible Printed Circuit Board
Apparatus for Detecting Defect in Circuit Pattern and Defect Detecting System Having the Same
Lead Frame for Semiconductor Package and Method of Fabricating Semiconductor Package
Lead Frame and Method of Manufacturing the Same
Lead Frame and Method for Manufacturing Semiconductor Package with the Same
Semiconductor Package Having Multiple Row of Leads
Flip Chip Semiconductor Device and Manufacturing Method Thereof
Substrate for Producing Semiconductor Packages
Lead Frame and Semiconductor Device Having the Lead Frame
Lead Frame Manufactured from Low-Priced Material and Not Requiring Strict Process Control, Semiconductor Package Including the Same, and Method of Manufacturing the Lead Frame and the Semiconductor Package
Apparatus for Roll-to-Roll Manufacturing Semiconductor Parts and Feeding Method Thereof
Adhesive Tape and Semiconductor Package Using the Same
Lead Frame and Method of Manufacturing the Same
Method of Manufacturing a Circuit Board
Device-Embedded Flexible Printed Circuit Board and Manufacturing Method Thereof
Method of Manufacturing Circuit Board and Circuit Board Manufactured by the Method
Application:
13/343,347 →
Publication:
US 2012/0292092
Lead Frame Manufactured from Low-Priced Material and Not Requiring Strict Process Control, Semiconductor Package Including the Same, and Method of Manufacturing the Lead Frame and the Semiconductor Package
Lead Frame and Semiconductor Package Including the Same
Circuit Board and Method of Manufacturing the Same
Application:
13/414,793 →
Publication:
US 2012/0298409
Method of Manufacturing Lead Frame for Light-Emitting Device Package and Light-Emitting Device Package
Lens Apparatus for Inspecting Object and Machine Vision System Including the Same
Application:
13/559,703 →
Publication:
US 2013/0147946
Method of Manufacturing Printed Circuit Board
Method of Manufacturing Multi-Layer Circuit Board and Multi-Layer Circuit Board Manufactured by Using the Method
Method of Preventing Epoxy Bleed Out of Lead Frame and Lead Frame Manufactured by Using the Same
Application:
13/686,168 →
Publication:
US 2013/0200506
Method of Forming via Hole in Circuit Board
Application:
13/727,038 →
Publication:
US 2013/0168349
Method of Forming Solder Resist Layer and Printed Circuit Board Comprising Solder Resist Layer
Application:
13/756,942 →
Publication:
US 2013/0192885
Method of Manufacturing Circuit Board and Chip Package and Circuit Board Manufactured by Using the Method
Reel-To-Reel Inspection Apparatus and Inspection Method Using the Same
Lead Frame, Semiconductor Package Including the Lead Frame, and Method of Manufacturing the Lead Frame
Method of Manufacturing Lead Frame
Related Assignments
(22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 4, 1996
From: KIM, YONG-YEON; HAN, SUNG-YOUNG
To: SAMSUNG AEROSPACE INDUSTRIES, LTD.
Reel/Frame 008020/0856 →
Assignment of Assignor's Interest
Oct 7, 1996
From: RYU, JAE-CHUL
To: SAMSUNG AEROSPACE INDUSTRIES, LTD
Reel/Frame 008172/0005 →
Assignment of Assignor's Interest
Jan 9, 1997
From: CHOI, O-DONG; KIM, JONG-UK
To: SAMSUNG AEROSPACE INDUSTRIES, LTD.
Reel/Frame 008319/0896 →
Assignment of Assignor's Interest
May 9, 1997
From: KIM, JOONG-DO; BAEK, YOUNG-HO
To: SAMSUNG AEROSPACE INDUSTRIES, LTD.
Reel/Frame 008509/0763 →
Assignment of Assignor's Interest
Jun 24, 1997
From: KIM, JOONG-DO; BAEK, YOUNG-HO
To: SAMSUNG AEROSPACE INDUSTRIES, LTD.
Reel/Frame 008573/0068 →
Assignment of Assignor's Interest
Jun 5, 1998
From: KIM, YUNG-JOON
To: SAMSUNG AEROSPACE INDUSTRIES, LTD.
Reel/Frame 009237/0358 →
Assignment of Assignor's Interest
Jun 18, 1998
From: KIM, JOONG-DO; BOK, KYOUNG-SOON
To: SAMSUNG AEROSPACE INDUSTRIES, LTD.
Reel/Frame 009283/0521 →
Assignment of Assignor's Interest
Jul 2, 1998
From: KIM, JOONG-DO; BAEK, YOUNG-HO; BOK, KYUNG-SOON
To: SAMSUNG AEROSPACE INDUSTRIES, LTD.
Reel/Frame 009291/0309 →
Assignment of Assignor's Interest
Aug 3, 1998
From: KIM, JOONG-DO; BAEK, YOUNG-HO; BOK, KY0UNG-SOON
To: SAMSUNG AEROSPACE INDUSTRIES, LTD.
Reel/Frame 009363/0302 →
Assignment of Assignor's Interest
Mar 2, 1999
From: PARK, SE-CHUL; LEE, KYU-HAN; KIM, JU-BONG; KANG, SUNG-IL
To: SAMSUNG AEROSPACE INDUSTRIES, LTD.
Reel/Frame 009807/0459 →
Assignment of Assignor's Interest
Jan 27, 2000
From: LEE, KYU-HAN; LEE, SANG-HUN; KANG, SUNG-IL; PARK, SE-CHUL
To: SAMSUNG AEROSPACE INDUSTRIES, LTD.
Reel/Frame 010529/0888 →
Assignment of Assignor's Interest
Dec 8, 2000
From: PARK, SE-CHUL; SHIN, DONG-IL; KANG, SUNG-IL; LEE, SANG-HOON
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 011345/0808 →
Assignment of Assignor's Interest
Mar 4, 2004
From: KIM, DEOK-HEUNG; LEE, BONG-HUI
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 015038/0258 →
Assignment of Assignor's Interest
Jun 1, 2004
From: JUNG, BOO-YANG; HAN, SEONG-YOUNG; KIM, BRUCE
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 015473/0778 →
Assignment of Assignor's Interest
Aug 20, 2004
From: KIM, JEUNG-IL; CHO, SE-HOON
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 015719/0835 →
Assignment of Assignor's Interest
Nov 4, 2004
From: PAEK, SUNG-KWAN; PARK, SE-CHUL; LEE, SANG-HUN
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 015969/0657 →
Assignment of Assignor's Interest
Feb 23, 2005
From: LEE, SANG-HUN; PAEK, SUNG-KWAN; PARK, SE-CHUEL
To: SAMSUNG TECHWIN CO., LTD., 28
Reel/Frame 016338/0589 →
Assignment of Assignor's Interest
Apr 12, 2005
From: KIM, JUNG-IL
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 016473/0789 →
Assignment of Assignor's Interest
May 20, 2005
From: JANG, CHANG-SOO; RYU, JAE-CHUL; WON, DONG-KWAN
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 016590/0173 →
Assignment of Assignor's Interest
May 20, 2005
From: PARK, KWANG-SUK; KIM, JUNG-DO
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 016591/0579 →
Assignment of Assignor's Interest
May 20, 2005
From: LEE, SOO-BONG; KIM, JUNG-DO; CHOI, WOO-SUKS; KIM, EUN-HEE
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 016589/0888 →
Change of Name
Apr 21, 2015
From: MDS CO. LTD.
To: HAESUNG DS CO., LTD.
Reel/Frame 035475/0415 →