Method of manufacturing lead frame
There is provided a method of manufacturing a lead frame, the method including: preparing a lead frame raw material; forming openings in the lead frame raw material so that the lead frame material includes: a die pad; a die pad supporting portion supporting the die pad; a rail portion supporting the die pad supporting portion; a lead supporting portion having both ends fixed to the die pad supporting portion; and a plurality of leads having a first end connected to the rail portion and a second end connected to the lead supporting portion; plating the lead frame raw material having the openings with a plating layer; and removing the lead supporting portion.
1. A method of manufacturing a lead frame, the method comprising:
preparing a lead frame raw material;
forming openings in the lead frame raw material so that the lead frame material comprises:
a die pad;
a die pad supporting portion supporting the die pad;
a rail portion supporting the die pad supporting portion;
a lead supporting portion having both ends fixed to the die pad supporting portion; and
a plurality of leads having a first end connected to the rail portion and a second end connected to the lead supporting portion;
plating the lead frame raw material having the openings with a plating layer;
removing the lead supporting portion; and
forming half etching portions on a surface of the lead frame raw material,
wherein the removing the lead supporting portion comprises:
moving the punch from an opposite surface of the surface having the half etching portions towards the surface having the half etching portions; and
removing the lead supporting portion.
2. The method of claim 1 , wherein the removing the lead supporting portion comprises pressing the lead frame raw material by a press working unit,
wherein the press working unit comprises:
the punch configured to move in a straight line; and
a die configured to support the lead frame raw material.
3. The method of claim 2 , wherein the die comprises a step portion.
4. A method of manufacturing a lead frame, the method comprising:
preparing a lead frame raw material;
forming openings in the lead frame raw material so that the lead frame material comprises:
a die pad;
a die pad supporting portion supporting the die pad;
a rail portion supporting the die pad supporting portion;
a lead supporting portion having both ends fixed to the die pad supporting portion; and
a plurality of leads having a first end connected to the rail portion and a second end connected to the lead supporting portion;
plating the lead frame raw material having the openings with a plating layer;
removing the lead supporting portion; and
forming half etching portions on a surface of the lead frame raw material,
wherein the removing the lead supporting portion comprises:
moving a punch from the surface having the half etching portions towards an opposite surface of the surface having the half etching portions; and
removing the lead supporting portion.
5. The method of claim 4 , wherein the die comprises a step portion.