Patent Assignment
Reel/Frame 035475/0415
Change of Name
Recorded: 2015-04-21
Pages: 14
Assignor
MDS CO. LTD.
Executed: 2014-09-01
Assignee
HAESUNG DS CO., LTD.
726, UNGNAM-RO, SEONGSAN-GU,, GYEONGSANGNAM-DO, CHANGWON-SI, 642-120, KOREA, REPUBLIC OF
Covered Properties
(34)
Lead Frame of a Semiconductor Device and a Method for Designing It
Patent:
5,808,355 →
Application:
08/658,126 →
Semiconductor Lead Frame
Patent:
5,767,574 →
Application:
08/792,211 →
Lead Frame for Semiconductor Device
Patent:
5,958,607 →
Application:
08/823,691 →
Method for Lead Frame Etching
Patent:
5,945,259 →
Application:
09/025,260 →
Semiconductor Lead Frame Having Multi-Layered Plating Layer Including Copper-Nickel Plating Layer
Patent:
6,037,653 →
Application:
09/046,656 →
Lead Frame Having a Ni-Mn Alloy Layer and a Pd Layer
Patent:
5,977,620 →
Application:
09/081,436 →
Lead Frame for Semiconductor Package and Lead Frame Plating Method
Patent:
6,150,713 →
Application:
09/260,471 →
Lead Frame and Method for Plating the Same
Patent:
6,469,386 →
Application:
09/492,402 →
Lead Frame and Method of Manufacturing the Lead Frame
Ag-Pre-Plated Lead Frame for Semiconductor Package
Lead Frame for Semiconductor Package and Method of Fabricating Semiconductor Package
Lead Frame and Method of Manufacturing the Same
Lead Frame and Method for Manufacturing Semiconductor Package with the Same
Semiconductor Package Having Multiple Row of Leads
Flip Chip Semiconductor Device and Manufacturing Method Thereof
Lead Frame and Semiconductor Device Having the Lead Frame
Lead Frame Manufactured from Low-Priced Material and Not Requiring Strict Process Control, Semiconductor Package Including the Same, and Method of Manufacturing the Lead Frame and the Semiconductor Package
Apparatus for Roll-to-Roll Manufacturing Semiconductor Parts and Feeding Method Thereof
Lead Frame and Method of Manufacturing the Same
Method of Manufacturing a Circuit Board
Device-Embedded Flexible Printed Circuit Board and Manufacturing Method Thereof
Method of Manufacturing Circuit Board and Circuit Board Manufactured by the Method
Application:
13/343,347 →
Publication:
US 2012/0292092
Lead Frame Manufactured from Low-Priced Material and Not Requiring Strict Process Control, Semiconductor Package Including the Same, and Method of Manufacturing the Lead Frame and the Semiconductor Package
Lead Frame and Semiconductor Package Including the Same
Method of Manufacturing Lead Frame for Light-Emitting Device Package and Light-Emitting Device Package
Method of Manufacturing Printed Circuit Board
Method of Manufacturing Multi-Layer Circuit Board and Multi-Layer Circuit Board Manufactured by Using the Method
Method of Preventing Epoxy Bleed Out of Lead Frame and Lead Frame Manufactured by Using the Same
Application:
13/686,168 →
Publication:
US 2013/0200506
Method of Forming via Hole in Circuit Board
Application:
13/727,038 →
Publication:
US 2013/0168349
Method of Manufacturing Circuit Board and Chip Package and Circuit Board Manufactured by Using the Method
Reel-To-Reel Inspection Apparatus and Inspection Method Using the Same
Lead Frame, Semiconductor Package Including the Lead Frame, and Method of Manufacturing the Lead Frame
Method of Manufacturing Lead Frame
Lead Frame and Semiconductor Package Manufactured by Using the Same
Related Assignments
(22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 4, 1996
From: KIM, YONG-YEON; HAN, SUNG-YOUNG
To: SAMSUNG AEROSPACE INDUSTRIES, LTD.
Reel/Frame 008020/0856 →
Assignment of Assignor's Interest
May 9, 1997
From: KIM, JOONG-DO; BAEK, YOUNG-HO
To: SAMSUNG AEROSPACE INDUSTRIES, LTD.
Reel/Frame 008509/0763 →
Assignment of Assignor's Interest
Jun 24, 1997
From: KIM, JOONG-DO; BAEK, YOUNG-HO
To: SAMSUNG AEROSPACE INDUSTRIES, LTD.
Reel/Frame 008573/0068 →
Assignment of Assignor's Interest
Jun 5, 1998
From: KIM, YUNG-JOON
To: SAMSUNG AEROSPACE INDUSTRIES, LTD.
Reel/Frame 009237/0358 →
Assignment of Assignor's Interest
Jun 18, 1998
From: KIM, JOONG-DO; BOK, KYOUNG-SOON
To: SAMSUNG AEROSPACE INDUSTRIES, LTD.
Reel/Frame 009283/0521 →
Assignment of Assignor's Interest
Aug 3, 1998
From: KIM, JOONG-DO; BAEK, YOUNG-HO; BOK, KY0UNG-SOON
To: SAMSUNG AEROSPACE INDUSTRIES, LTD.
Reel/Frame 009363/0302 →
Assignment of Assignor's Interest
Mar 2, 1999
From: PARK, SE-CHUL; LEE, KYU-HAN; KIM, JU-BONG; KANG, SUNG-IL
To: SAMSUNG AEROSPACE INDUSTRIES, LTD.
Reel/Frame 009807/0459 →
Assignment of Assignor's Interest
Jan 27, 2000
From: LEE, KYU-HAN; LEE, SANG-HUN; KANG, SUNG-IL; PARK, SE-CHUL
To: SAMSUNG AEROSPACE INDUSTRIES, LTD.
Reel/Frame 010529/0888 →
Assignment of Assignor's Interest
Dec 8, 2000
From: PARK, SE-CHUL; SHIN, DONG-IL; KANG, SUNG-IL; LEE, SANG-HOON
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 011345/0808 →
Assignment of Assignor's Interest
Aug 17, 2001
From: PARK, SE-CHUL; KIM, NAM-SEOG
To: SAMSUNG TECHWIN CO., LTD.; SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 012081/0767 →
Assignment of Assignor's Interest
Aug 20, 2004
From: KIM, JEUNG-IL; CHO, SE-HOON
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 015719/0835 →
Assignment of Assignor's Interest
Nov 4, 2004
From: PAEK, SUNG-KWAN; PARK, SE-CHUL; LEE, SANG-HUN
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 015969/0657 →
Assignment of Assignor's Interest
Feb 23, 2005
From: LEE, SANG-HUN; PAEK, SUNG-KWAN; PARK, SE-CHUEL
To: SAMSUNG TECHWIN CO., LTD., 28
Reel/Frame 016338/0589 →
Assignment of Assignor's Interest
Apr 12, 2005
From: KIM, JUNG-IL
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 016473/0789 →
Assignment of Assignor's Interest
May 20, 2005
From: LEE, SOO-BONG; KIM, JUNG-DO; CHOI, WOO-SUKS; KIM, EUN-HEE
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 016589/0888 →
Assignment of Assignor's Interest
May 20, 2005
From: PARK, KWANG-SUK; KIM, JUNG-DO
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 016591/0579 →
Assignment of Assignor's Interest
May 15, 2009
From: KANG, SUNG-IL; SHIM, CHANG-HAN
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 022690/0429 →
Assignment of Assignor's Interest
Aug 21, 2009
From: CHOI, WOO-SUK; KIM, DEOK-HEUNG
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 023130/0355 →
Assignment of Assignor's Interest
Sep 16, 2010
From: SHIM, CHANG-HAN; PAEK, SUNG-KWAN
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 024998/0042 →
Assignment of Assignor's Interest
Sep 27, 2010
From: LEE, SANG-,MIN; KIM, DEOK-HEUNG; NA, DOC-HWA
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 025046/0209 →
Assignment of Assignor's Interest
Jul 16, 2014
From: SAMSUNG TECHWIN CO., LTD.
To: MDS CO. LTD.
Reel/Frame 033327/0442 →
Assignment of Assignor's Interest
Jul 16, 2014
From: SAMSUNG TECHWIN CO., LTD.
To: MDS CO. LTD.
Reel/Frame 033326/0421 →