Patent Assignment
Reel/Frame 016591/0579
Assignment of Assignor's Interest
Recorded: 2005-05-20
Pages: 4
Assignee
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, CHANGWON-CITY; KYONGSANGNAM-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Flip Chip Semiconductor Device and Manufacturing Method Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.