Patent Assignment
Reel/Frame 022690/0429
Assignment of Assignor's Interest
Recorded: 2009-05-15
Pages: 2
Assignee
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, KYONGSANGNAM-DO, CHANGWON-CITY, KOREA, REPUBLIC OF
Covered Property
(1)
Lead Frame Manufactured from Low-Priced Material and Not Requiring Strict Process Control, Semiconductor Package Including the Same, and Method of Manufacturing the Lead Frame and the Semiconductor Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.