IP Library › Granted Patent US 6,518,508
Granted Patent Utility
US 6,518,508 · Confirmation No. 2186

AG-PRE-PLATED LEAD FRAME FOR SEMICONDUCTOR PACKAGE

Patented Case View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2001-06-12 TRNA Transmittal of New Application 2 View
2001-06-12 SPEC Specification 27 View
2001-06-12 CLM Claims 4 View
2001-06-12 ABST Abstract 1 View
2001-06-12 DRW Drawings-only black and white line drawings 6 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
Patent No.
US 6,518,508
App. No.
09/878,341
Filed
2001-06-12
Granted
2003-02-11
Pub. No.
US20020104682A1
Art Unit
2827
PTA
-115 days