Patent Assignment
Reel/Frame 012081/0767
Assignment of Assignor's Interest
Recorded: 2001-08-17
Pages: 3
Assignees
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, CHANGWON-CITY, KYONGSANGNAM-DO, KOREA, REPUBLIC OF
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Ag-Pre-Plated Lead Frame for Semiconductor Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.