Granted Patent
Utility
US 6,518,508 · App. 09/878,341
Ag-pre-plated lead frame for semiconductor package
Inventors:
Se-chul Park, Nam-Seog Kim
Patented Case
View Patent ↗
Granted: Feb 11, 2003
Filed: Jun 12, 2001
Inventors
Se-chul Park
Nam-Seog Kim
Assignees (at issue)
SAMSUNG TECHWIN CO., LTD.
SAMSUNG DISPLAY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.