Assignment of Assignor's Interest

Recorded: 2014-07-16 Pages: 2

Assignor

SAMSUNG TECHWIN CO., LTD.

Executed: 2014-04-30

Assignee

MDS CO. LTD.

84, JEONGDONG-RO, SEONGSAN-GU,, GYEONGSANGNAM-DO,, CHANGWON-SI, 641-120, KOREA, REPUBLIC OF

Covered Property (1)

Ag-Pre-Plated Lead Frame for Semiconductor Package

Patent: 6,518,508 →

Application: 09/878,341 →

Publication: US 2002/0104682

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.