Lead frame for semiconductor package and method of fabricating semiconductor package
Provided is a method for fabricating a semiconductor package with a lead frame and the semiconductor package provided thereof. The method includes supplying a lead frame with a plurality of molding regions for molding a plurality of semiconductor packages, and attaching tape to at least one surface of the lead frame to prevent a molten molding material from contacting the lead frame on that surface. The tape comprises a plurality of vacant regions corresponding to the boundary of each molding region. This method distributes the tension and expansion stress of the tape caused by a heating roller when laminating the tape on the lead frame, thereby preventing bending of the strip.
1. A method of fabricating a semiconductor package with a lead frame comprising:
supplying a lead frame with a plurality of regions for incorporating a plurality of semiconductor packages thereon;
providing a tape in a roll form, the tape having a width smaller than the width of the lead frame;
cutting the tape into a plurality of separate tapes, a length of each cut tape corresponding to the length of each semiconductor package incorporating region of the lead frame; and
attaching the cut tapes one after another to a surface of the lead frame in a manner to cover substantially the entire surface of the lead frame except boundary areas lying around and between the semiconductor package incorporating regions such that a molding material can be prevented from adhering to the covered surfaces of the lead frame during a subsequent molding process of the semiconductor packages.
2. The method of claim 1 , wherein the tape attaching step is performed by thermal compression with a heating roller.
3. The method of claim 1 , wherein a plurality of lead frames are supplied in series for the attachment of the tapes to the lead frames.
4. A method of fabricating a semiconductor package with a lead frame comprising:
supplying a lead frame with a plurality of regions for incorporating a plurality of semiconductor packages thereon;
providing a tape in a roll form, the tape having a width smaller than the width of the lead frame;
cutting the roll tape into a cut tape, the cut tape having a length smaller than the length of the lead frame;
attaching the cut tape to a surface of the lead frame in a manner to cover substantially the entire surface of the lead frame except outer circumferential areas of the lead frame; and
removing portions of tape from boundary areas lying between the semiconductor package incorporating regions such that a unitary tape, having a plurality of main regions for covering the semiconductor package incorporating regions of the lead frame and at least one bridge region of predetermined width for connecting adjacent main regions of the tape, is formed on the surface of the lead frame and that a molding material can be prevented from adhering to the tape covered surfaces of the lead frame during a subsequent molding process of the semiconductor packages.
5. The method of claim 4 , wherein the tape removing step is performed by punching holes or slots of a predetermined width in the boundary areas after the attachment of the tape to the lead frame.
6. The method of claim 4 , wherein portions of tape are removed from areas adjacent to through holes formed in the lead frame.
7. The method of claim 4 , wherein portions of tape are removed from central regions of the boundary areas.
8. The method of claim 4 , wherein portions of tape are removed from side regions of the boundary areas.
9. A method of fabricating a semiconductor package with a lead frame comprising:
supplying a lead frame having a width, a length, a first end, and a second end, the lead frame including a plurality of semiconductor package incorporating regions arranged in the lead frame and a plurality of bridge regions each defined between two adjacent ones of the semiconductor package incorporating regions;
providing a tape in a roll form, the tape having a width corresponding to the width of the lead frame and having a length at least the same with or longer than the length of the lead frame;
placing a starting end of the tape on the lead frame such that the starting end of the tape corresponds to a starting end of a first one of the semiconductor package incorporating regions;
placing a heating roller on the placed starting end of the tape;
rolling the heating roller in a direction to the second end of the lead frame;
cutting the tape such that the ending end of a resultant first cut tape corresponds to the ending end of the first one of the semiconductor package incorporating regions;
placing a subsequent starting end of the tape on the lead frame such that the subsequent starting end of the tape corresponds to a starting end of a subsequent one of the semiconductor package incorporating regions, and thereby defining a tape uncovered region corresponding to the width of the bridge region of the lead frame;
placing the heating roller on the placed subsequent starting end of the tape;
rolling the heating roller in a direction to the second end of the lead frame;
cutting the tape such that the ending end of a resultant subsequent cut tape corresponds to the ending end of a subsequent one of the semiconductor package incorporating regions; and
repeating the immediately above four steps of placing through cutting to a next one of the semiconductor package incorporating regions until a resultant last cut tape covers a last one of the semiconductor package incorporating regions in the lead frame.