Patent Assignment
Reel/Frame 015719/0835
Assignment of Assignor's Interest
Recorded: 2004-08-20
Pages: 4
Assignee
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, CHANGWON-CITY, KYONGSANGNAM-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Lead Frame for Semiconductor Package and Method of Fabricating Semiconductor Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.