Patent Assignment
Reel/Frame 016338/0589
Assignment of Assignor's Interest
Recorded: 2005-02-23
Pages: 4
Assignors
LEE, SANG-HUN
Executed: 2005-02-23
PAEK, SUNG-KWAN
Executed: 2005-02-23
PARK, SE-CHUEL
Executed: 2005-02-23
Assignee
SAMSUNG TECHWIN CO., LTD., 28
SUNGJU-DONG, CHANGWON-CITY, KYONGSANGNAM-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Lead Frame and Method for Manufacturing Semiconductor Package with the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.