Patent Assignment
Reel/Frame 009283/0521
Assignment of Assignor's Interest
Recorded: 1998-06-18
Pages: 2
Assignee
SAMSUNG AEROSPACE INDUSTRIES, LTD.
28 SUNGJU-DONG, CHANGWON-CITY, KYONGSANGNAM-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Lead Frame Having Multi-Layered Plating Layer Including Copper-Nickel Plating Layer
Patent:
6,037,653 →
Application:
09/046,656 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.