Semiconductor package having multiple row of leads
Provided is a method of producing a semiconductor package including at least two rows of leads in which the leads of each row separately connecting a semiconductor chip to an external substrate. The method includes: forming a lead frame, the lead frame including a die pad and a plurality of leads arranged about the die pad; attaching an adhesive tape to a surface of the lead frame covering at least substantially the die pad and the plurality of leads; removing portions of the leads and the adhesive tape disposed in a dividing region and thereby separating at least some of the plurality of leads to form multiple rows of leads; and mounting a semiconductor chip on the die pad, electrically connecting the semiconductor chip with the lead frame, and molding the lead frame and the semiconductor chip to provide a semiconductor package. The adhesive tape attached at undesirable locations of the lead frame is preferably removed after provision of the semiconductor package.
1. A lead frame for a semiconductor package comprising:
an outer frame formed of a conductive material;
a die pad disposed adjacent to a central portion of the outer frame;
a plurality of leads extending from the outer frame and arranged about the die pad, at least some of the plurality of leads being separated in a dividing region and thereby defining at least two rows of leads; and
an adhesive sheet attached at a lower surface of the lead frame covering at least substantially the die pad and the plurality of leads except the dividing region of the leads.
2. The lead frame of claim 1 , wherein the plurality of leads define two rows of leads separated from each other by the dividing region.
3. The lead frame of claim 1 , wherein the plurality of leads define three rows of leads separated from each other by the dividing region.
4. The lead frame of claim 1 , further comprising tie-bars for connecting the die pad with the outer frame.
5. The lead frame of claim 1 , further comprising dam-bars for connecting the leads at predetermined locations of the leads.