IP Library › Assignment 009807/0459
Patent Assignment
Reel/Frame 009807/0459

Assignment of Assignor's Interest

Recorded: 1999-03-02 Pages: 3
Assignors
PARK, SE-CHUL
Executed: 1999-02-25
LEE, KYU-HAN
Executed: 1999-02-25
KIM, JU-BONG
Executed: 1999-02-25
KANG, SUNG-IL
Executed: 1999-02-25
SHIN, DONG-IL
Executed: 1999-02-25
JANG, BAE-SOON
Executed: 1999-02-25
Assignee
SAMSUNG AEROSPACE INDUSTRIES, LTD.
28 SUNGJU-DONG, CHANGWON-CITY, KYONGSANGNAM-DO, KOREA, REPUBLIC OF
Covered Property (1)
Lead Frame for Semiconductor Package and Lead Frame Plating Method
Patent: 6,150,713 →
Application: 09/260,471 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 16, 2014
From: SAMSUNG TECHWIN CO., LTD.
To: MDS CO. LTD.
Reel/Frame 033327/0442 →
Change of Name Apr 21, 2015
From: MDS CO. LTD.
To: HAESUNG DS CO., LTD.
Reel/Frame 035475/0415 →