METHOD OF PREVENTING EPOXY BLEED OUT OF LEAD FRAME AND LEAD FRAME MANUFACTURED BY USING THE SAME
The epoxy bleed out prevention method including: providing a lead frame that is manufactured through a shaping process which forms a die pad and a plurality of leads by using a conductive raw material, a pre-plating process performed on the shaped conductive raw material, and a tape attaching process; and performing a bleed out prevention process which prevents an epoxy bleed out of a die bonding epoxy-based resin applied on the die pad after the tape attaching process.
1 . An epoxy bleed out prevention method comprising:
providing a lead frame manufactured through a shaping process which forms a die pad and a plurality of leads by using a conductive raw material, a pre-plating process performed on the shaped conductive raw material, and a tape attaching process; and
performing a bleed out prevention process which prevents an epoxy bleed out of a die bonding epoxy-based resin applied on the die pad after the tape attaching process.
2 . The method of claim 1 , wherein the pre-plating process comprises applying a surface roughness.
3 . The method of claim 1 , wherein a tape used in the tape attaching process comprises a lead lock tape which fixes a plurality of leads, or a back side tape which prevents a mold flash.
4 . The method of claim 1 , wherein the die bonding epoxy-based resin comprises a component which reduces stress, elasticity, or viscosity.
5 . The method of claim 1 , wherein the performing of the bleed out prevention process comprises applying a liquid-type bleed out prevention agent only on the die pad under a dry environment.
6 . The method of claim 5 , wherein the dry environment is the same as an environment where the tape attaching process is performed.
7 . The method of claim 5 , wherein a dry-type spray module sprays the liquid-type bleed out prevention agent.
8 . The method of claim 7 , wherein the dry-type spray module comprises an ultrasonic spray module.
9 . The method of claim 5 , wherein the liquid-type bleed out prevention agent comprises water or an organic solvent
10 . The method of claim 9 , wherein the organic solvent comprises at least one solvent selected from the group consisting of methanol, ethanol, isopropanol, acetone, and methylethylketone.
11 . The method of claim 1 , wherein the performing of the bleed out prevention process is applied on one surface of the die pad.
12 . The method of claim 1 , further comprising performing a surface treatment process using an atmospheric pressure plasma discharge, between the tape attaching process and the performing of the bleed out prevention process.
13 . The method of claim 1 , wherein the conductive raw material comprises a reel-type conductive raw material, a tape used in the tape attaching process comprises a continuous reel-type tape, and the method further comprises performing a cut-off process which cuts a reel type lead frame , on which the epoxy bleed out prevention process is performed, into lead frame strips.
14 . The method of claim 13 , wherein the cut-off process, the tape attaching process and the epoxy bleed out prevention process are performed under a dry environment.
15 . The method of claim 1 , wherein the conductive raw material is reeled, and the method further comprises performing a cut-off process which cuts the lead frame of a reel type into lead frame strips between the shaping process and the pre-plating process,
wherein the tape attaching process is performed in an individual strip taping method.
16 . A lead frame manufactured by the performing of the epoxy bleed out prevention method according to claim 1 .
17 . An epoxy bleed out prevention method for a lead frame including a die pad and a plurality of leads, the method comprising:
attaching a tape to the lead frame; and
performing a bleed out prevention process which prevents an epoxy bleed out of a die bonding epoxy-based resin applied on the die pad after the attaching the tape to the lead frame.
18 . The method of claim 17 , wherein the performing of the bleed out prevention process comprises applying a bleed out prevention agent only on the die pad under a dry environment.
19 . An epoxy bleed out prevention method for a lead frame including a die pad and a plurality of leads, the method comprising:
providing a conductive raw material;
shaping the lead frame including the die pad and the plurality of leads using the conductive raw material;
performing a pre-plating process;
attaching a tape onto the lead frame;
performing a bleed out prevention process; and
cutting the lead frame into strip type lead frames,
wherein the attaching of the tape, the performing of the bleed out prevention process and the cutting of the lead frame are performed under a same condition.
20 . The method of claim 19 , wherein the performing the bleed out prevention process is performed after the attaching of the tape, and
wherein the attaching of the tape, the performing of the bleed out prevention process and the cutting of the lead frame are performed under a dry condition.