Assignment of Assignor's Interest

Recorded: 2012-11-27 Pages: 4

Assignor

PARK, SANG-YEARL

Executed: 2012-11-14

Assignee

SAMSUNG TECHWIN CO., LTD.

28 SUNGJU-DONG, KYONGSANGNAM-DO, CHANGWON-CITY, KOREA, REPUBLIC OF

Covered Property (1)

Method of Preventing Epoxy Bleed Out of Lead Frame and Lead Frame Manufactured by Using the Same

Application: 13/686,168 →

Publication: US 2013/0200506

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.