Adhesive tape and semiconductor package using the same
Provided is an adhesive tape which adheres two members to each other and decreases problems that may occur due to contraction and expansion of the adhered members when the temperature of the adhered two members changes. The adhesive tape includes: a base film having insulating properties; and an adhesive agent that adheres on both sides of the base film, wherein a coefficient of thermal expansion of the base film is 10 ppm or lower, a coefficient of thermal expansion of the adhesive tape is lower than 17 ppm, and an occupation rate of the base film in the adhesive tape exceeds 50%.
1. An adhesive tape, which adheres two members to each other, the adhesive tape comprising:
a base film having insulating properties; and
an adhesive agent that adheres on both sides of the base film,
wherein a coefficient of thermal expansion of the base film is 10 ppm or lower, a coefficient of thermal expansion of the adhesive tape is lower than 17 ppm, and an occupation rate of the base film in the adhesive tape exceeds 50%.
2. The adhesive tape of claim 1 , wherein the base film is a polyimide film.
3. The adhesive tape of claim 1 , wherein the two members are a semiconductor chip and a lead of a semiconductor package including the semiconductor chip, respectively.
4. The adhesive tape of claim 1 , wherein the coefficient of thermal expansion and a modulus of the base film are respectively in a range of 1 to 5 ppm and in a range of 7 to 9 GPa, and a coefficient of thermal expansion and a modulus of the adhesive agent are respectively in a range of 20 to 100 ppm and in a range of 0.5 to 4 GPa.
5. The adhesive tape of claim 1 , wherein the coefficient of thermal expansion and a modulus of the base film are respectively in a range of 3 to 5 ppm and in a range of 3 to 5 GPa, a coefficient of thermal expansion and a modulus of the adhesive agent are respectively in a range of 20 to 100 ppm and in a range of 0.5 to 4 GPa, and an occupation rate of the base film in the adhesive tape exceeds 60%.
6. A semiconductor package comprising:
a semiconductor chip that controls operations of an apparatus;
a plurality of leads that electrically connect the semiconductor chip and the apparatus;
a plurality of bonding wires that electrically connect the plurality of leads and the semiconductor chip;
adhesive tapes that mutually adhere the plurality of leads and the semiconductor chip; and
a molding resin that entirely seals the semiconductor chip and the plurality of bonding wires, and the adhesive tapes, and partially seals the plurality of leads,
wherein each of the adhesive tapes comprises a base film having insulating properties and an adhesive agent adhered to both sides of the base film, a coefficient of thermal expansion each of the adhesive tapes is lower than 17 ppm, and an occupation rate of the base film in the adhesive tape exceeds 50%.
7. The semiconductor package of claim 6 , wherein coefficients of thermal expansion of the semiconductor chip and the plurality of leads are equal to or lower than 10 ppm.