Patent Assignment
Reel/Frame 016590/0173
Assignment of Assignor's Interest
Recorded: 2005-05-20
Pages: 4
Assignors
JANG, CHANG-SOO
Executed: 2005-05-12
RYU, JAE-CHUL
Executed: 2005-05-12
WON, DONG-KWAN
Executed: 2005-05-12
Assignee
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, CHANGWON-CITY, KYONGSANGNAM-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate for Producing Semiconductor Packages
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.