METHOD OF FORMING SOLDER RESIST LAYER AND PRINTED CIRCUIT BOARD COMPRISING SOLDER RESIST LAYER
Provided are a method of forming a solder resist layer on a printed circuit board (PCB) and a PCB comprising the solder resist layer. The method includes: preparing a PCB of which at least one surface has a circuit layer formed thereon, bonding an insulation layer, including a material having a non-photosensitive characteristic, in a half-cured state on the circuit layer, forming a solder resist layer patterned by selectively removing the insulation layer, and curing the insulation layer.
1 . A method of forming a solder resist layer comprising:
preparing a printed circuit board (PCB) of which at least one surface has a circuit layer formed thereon;
bonding an insulation layer, comprising a material having a non-photosensitive characteristic, in a half-cured state on the circuit layer;
forming a solder resist layer patterned by selectively removing the insulation layer; and
curing the insulation layer.
2 . The method according to claim 1 , wherein the material of the insulation layer is identical to a material constituting a core layer of the PCB.
3 . The method according to claim 2 , wherein the material of the insulation layer comprises at least one of epoxy resin, polyimide resin, Bismaleimide Triazine (BT) resin and Teflon resin.
4 . The method according to claim 1 , wherein the material of the insulation layer comprises at least one of epoxy resin, polyimide resin, Bismaleimide Triazine (BT) resin and Teflon resin.
5 . The method according to claim 1 , wherein the insulation layer is a prepreg.
6 . The method according to claim 1 , wherein in the forming the solder resist layer, the insulation layer is selectively removed by disposing a film on the insulation layer and patterning the solder resist using the film as a mask.
7 . The method according to claim 6 , where the bonding the insulation layer comprises:
tack-bonding the insulation layer and the metal thin film on at least one surface of the circuit layer; and
patterning a metal thin film by selectively etching the metal thin film.
8 . The method according to claim 7 , further comprising:
removing the metal thin film before the curing the insulation layer or after the curing the insulation layer.
9 . The method according to claim 8 , wherein the removing the metal thin film comprises etching and removing the metal thin film in its entirety.
10 . The method according to claim 1 , wherein the preparing the PCB comprises preparing a PCB of which an upper surface and a lower surface have respective circuits formed thereon,
wherein the bonding the insulation layer comprises bonding respective insulation layers on the upper surface and the lower surface of the PCB,
wherein the forming the solder resist layer comprises forming respective solder resist layers by selectively removing the respective insulation layers, and
wherein the curing the insulation layer comprises curing the respective insulation layers.
11 . The method according to claim 10 , wherein the respective solder resist layers are formed simultaneously by selectively removing the respective insulation layers simultaneously.
12 . A printed circuit board (PCB) comprising the solder resist layer formed by the method according to claim 1 .
13 . The PCB of claim 12 , wherein the material of the insulation layer is identical to a material constituting a core layer of the PCB.
14 . The PCB of claim 13 , wherein the material of the insulation layer comprises at least one of epoxy resin, polyimide resin, Bismaleimide Triazine (BT) resin and Teflon resin.
15 . The PCB of claim 12 , wherein the material of the insulation layer comprises at least one of epoxy resin, polyimide resin, Bismaleimide Triazine (BT) resin and Teflon resin.
16 . A printed circuit board (PCB) comprising:
a substrate;
a circuit layer formed on at least one surface of the substrate; and
a solder resist layer formed on the circuit layer,
wherein the solder resist layer comprises a material having a non-photosensitive characteristic.
17 . The PCB of claim 16 , wherein the material of the solder resist layer is identical to a material constituting a core layer of the PCB.
18 . The PCB of claim 17 , wherein the material of the solder resist layer comprises at least one of epoxy resin, polyimide resin, Bismaleimide Triazine (BT) resin and Teflon resin.
19 . The PCB of claim 16 , wherein the material of the solder resist layer comprises at least one of epoxy resin, polyimide resin, Bismaleimide Triazine (BT) resin and Teflon resin.