Patent Assignment
Reel/Frame 029740/0026
Assignment of Assignor's Interest
Recorded: 2013-02-01
Pages: 4
Assignee
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, KYONGSANGNAM-DO, CHANGWON-CITY, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming Solder Resist Layer and Printed Circuit Board Comprising Solder Resist Layer
Application:
13/756,942 →
Publication:
US 2013/0192885
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.