Patent Assignment
Reel/Frame 008504/0374
Assignment of Assignor's Interest
Recorded: 1997-04-23
Pages: 3
Assignor
JENNINGS, DEAN
Executed: 1997-04-22
Assignee
ELANTEC, INC.
1996 TAROB COURT, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Polysilicon Filled Trench Isolation Structure for Soi Integrated Circuits
Patent:
6,096,621 →
Application:
08/841,493 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
May 5, 2010
From: INTERSIL CORPORATION; TECHWELL, INC.; INTERSIL COMMUNICATIONS, INC.; QUELLAN, INC.
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 024337/0395 →
Release of Security Interest
May 26, 2010
From: CREDIT SUISSE FIRST BOSTON
To: INTERSIL CORPORATION
Reel/Frame 024445/0049 →
Merger
May 7, 2014
From: ELANTEC, INC.
To: ELANTEC SEMICONDUCTOR, INC.
Reel/Frame 032843/0153 →
Change of Name
May 16, 2014
From: ELANTEC SEMICONDUCTOR, INC.
To: ELANTEC SEMICONDUCTOR LLC
Reel/Frame 032917/0310 →
Assignment of Assignor's Interest
May 28, 2014
From: ELANTEC SEMICONDUCTOR LLC
To: INTERSIL AMERICAS LLC
Reel/Frame 032980/0230 →