Patent Assignment
Reel/Frame 008504/0465
Assignment of Assignor's Interest
Recorded: 1997-04-18
Pages: 2
Assignor
TANAKA, JUNICHI
Executed: 1997-04-04
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Lead Frame for Hollow Plastic Package
Patent:
5,883,424 →
Application:
08/839,337 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 16, 2002
From: NEC CORPORATION
To: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Reel/Frame 013392/0729 →
Assignment of Assignor's Interest
Apr 4, 2006
From: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017422/0528 →
Change of Name
Oct 21, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025173/0161 →