Patent Assignment
Reel/Frame 008507/0844
Assignment of Assignor's Interest
Recorded: 1997-02-14
Pages: 6
Assignors
CARON, A. ROLAND
Executed: 1997-02-13
JEAN, SANDRA L.
Executed: 1997-02-13
KEATING, JAMES E.
Executed: 1997-02-13
LARMOUTH, ROBERT S.
Executed: 1997-02-13
MILLETTE, LEE J.
Executed: 1997-02-13
Assignee
TELEDYNE INDUSTRIES, INC.
1901 AVENUE OF THE STARS, LOS ANGELES, CALIFORNIA, 90067
Covered Property
(1)
Multilayer Combined Rigid/Flex Printed Circuit Board Containing Flexible Soldermask
Application:
08/800,844 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
May 9, 2000
From: COLLABORATIVE GROUP, LTD. THE
To: TRANSAMERICA BUSINESS CREDIT CORPORATION
Reel/Frame 010776/0733 →
Security Agreement
Jun 22, 2000
From: COLLABORATIVE LABORATORIES, INC.
To: SILICON VALLEY BANK
Reel/Frame 010919/0037 →
Release of Security Interest
Jul 13, 2004
From: SILICON VALLEY BANK
To: COLLABORATIVE LABORATORIES, INC.
Reel/Frame 015583/0702 →