Assignment of Assignor's Interest

Recorded: 1997-04-22 Pages: 3

Assignor

BALL, MICHAEL B.

Executed: 1997-04-15

Assignee

MICRON TECHNOLOGY, INC.

8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83707

Covered Property (1)

Method of Improving Interconnect of Semicinductor Device by Utilizing a Flattened Ball Bond

Patent: 5,976,964 →

Application: 08/840,604 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.