Patent Assignment
Reel/Frame 028084/0627
Assignment of Assignor's Interest
Recorded: 2012-04-20
Pages: 10
Assignor
MICRON TECHNOLOGY, INC.
Executed: 2012-03-16
Assignee
ROUND ROCK RESEARCH, LLC
P. O. BOX 1042, MOUNT KISCO, NEW YORK, 10549
Covered Properties
(59)
Memory System with Non-Volatile Data Storage Unit and Method of Initializing Same
Patent:
5,615,159 →
Application:
08/563,505 →
Extended Travel Wire Bonding Machine
Patent:
5,813,590 →
Application:
08/574,156 →
Memory System with Non-Volatile Data Storage Unit and Method of Initializing Same
Patent:
5,677,885 →
Application:
08/751,072 →
Method of Improving Interconnect of Semicinductor Device by Utilizing a Flattened Ball Bond
Patent:
5,976,964 →
Application:
08/840,604 →
Memory System Having Flexible Bus Structure and Method
Patent:
6,021,459 →
Application:
08/847,641 →
A Positioning Device for Controlling the Position of a Workpiece in a Horizontal Plane
Patent:
6,015,079 →
Application:
08/905,183 →
Method for Fabricating a Semiconductor Interconnect with Laser Machined Electrical Paths Through Substrate
Patent:
6,107,109 →
Application:
08/993,965 →
A Method for Positioning the Bond Head in a Wire Bonding Machine
Patent:
6,196,445 →
Application:
09/208,279 →
Method of Improving Interconnect of Semiconductor Devices by Utilizing a Flattened Ball Bond
Patent:
6,034,440 →
Application:
09/234,140 →
Extended Travel Wire Bonding Machine
Patent:
6,223,967 →
Application:
09/241,467 →
Memory System Having Flexible Bus Structure and Method
Patent:
6,212,123 →
Application:
09/351,879 →
Semiconductor Interconnect Having Laser Machined Contacts
Patent:
6,294,837 →
Application:
09/385,606 →
Memory Device Tester and Method for Testing Reduced Power States
Patent:
6,418,070 →
Application:
09/388,566 →
Method of Improving Interconnect of Semiconductor Devices by Using a Flattened Ball Bond
Patent:
6,165,887 →
Application:
09/391,638 →
Method of Improving Interconnect of Semiconductor Devices by Using a Flattened Ball Bond
Patent:
6,420,256 →
Application:
09/684,448 →
A Method for Positioning the Bond Head in a Wire Bonding Machine
Patent:
6,276,594 →
Application:
09/695,110 →
Method for positioning the bond head in a wire bonding machine
Patent:
6,253,990 →
Application:
09/695,111 →
wire bonding machine
Patent:
6,321,970 →
Application:
09/695,368 →
A Methid for Positioning the Bond Head in a Wire Bonding Machine
Patent:
6,253,991 →
Application:
09/695,376 →
Memory system having flexible bus structure and method
Patent:
6,396,729 →
Application:
09/711,413 →
Memory System Having Flexible Bus Structure and Method
Patent:
6,567,335 →
Application:
09/711,416 →
Memory System Having Flexible Bus Structure and Method
Patent:
6,515,936 →
Application:
09/711,417 →
Momory system having flexible bus structure and method
Patent:
6,320,815 →
Application:
09/711,623 →
Memory system having flexible bus structure and method
Patent:
6,353,571 →
Application:
09/711,812 →
Semiconductor Interconnect Having Laser Machined Contacts
Patent:
6,833,613 →
Application:
09/961,646 →
Method for Fabricating Semiconductor Components and Interconnects with Contacts on Opposing Sides
Patent:
6,620,731 →
Application:
10/035,355 →
Memory Device Tester and Method for Testing Reduced Power States
Memory Device Tester and Method for Testing Reduced Power States
Memory Device Tester and Method for Testing Reduced Power States
Method of Improving Interconnect of Semiconductor Devices by Utilizing a Flattened Ball Bond
Semiconductor component and interconnect having conductive members and contacts on opposing sides
Method for Fabricating Semiconductor Components by Forming Conductive Members Using Solder
Semiconductor package having interconnect with conductive members
Memory Command Delay Balancing in a Daisy-Chained Memory Topology
Data Retention Kill Function
Memory Device Tester and Method for Testing Reduced Power States
Non-Volatile Hard Disk Drive Cache System and Method
Method and Apparatus for Improving Storage Performance Using a Background Erase
Data Retention Kill Function
System and Method for Initiating a Bad Block Disable Process in a Non-Volatile Memory
Memory System and Method Having Volatile and Non-Volatile Memory Devices at Same Hierarchical Level
Memory Device Architectures and Operation
Memory Register Encoding Systems and Methods
Hybrid Memory Management
System and Method for Initiating a Bad Block Disable Process in a Non-Volatile Memory
Data Retention Kill Function
Method and Apparatus for Improving Storage Performance Using a Background Erase
Memory System and Method Having Volatile and Non-Volatile Memory Devices at Same Hierarchical Level
Memory Command Delay Balancing in a Daisy-Chained Memory Topology
Data Retention Kill Function
Memory System and Method Having Volatile and Non-Volatile Memory Devices at Same Hierarchical Level
Methods of Operating Memory Devices Including Different Sets of Logical Erase Blocks
Memory Command Delay Balancing in a Daisy-Chained Memory Topology
Memory System and Method Having Volatile and Non-Volatile Memory Devices at Same Hierarchical Level
Memory Register Encoding Systems and Methods
Non-Volatile Hard Disk Drive Cache System and Method
Memory Devices and Their Operation with Different Sets of Logical Erase Blocks
Data Retention Kill Function
Hybrid Memory Management
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 18, 1995
From: FOGAL, RICH; BALL, MICHAEL B.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 007886/0975 →
Assignment of Assignor's Interest
Nov 18, 1996
From: ROOHPARVAR, FRANKIE F.
To: MICRON QUANTUM DEVICES, INC.
Reel/Frame 008224/0276 →
Assignment of Assignor's Interest
Apr 22, 1997
From: BALL, MICHAEL B.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 008531/0331 →
Assignment of Assignor's Interest
Dec 18, 1997
From: AKRAM, SALMAN; FARNWORTH, WARREN M.; WOOD, ALAN G.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 008940/0739 →
Assignment of Assignor's Interest
Apr 16, 1999
From: NORMAN, ROBERT D.; LAKHANI, VINOD; CHEVALLIER, CHRISTOPHER J.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 009898/0122 →
Assignment of Assignor's Interest
Apr 27, 2000
From: HARRINGTON, MATTHEW R.; HUYNH, VAN C.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 010762/0844 →
Merger
Dec 11, 2012
From: MICRON QUANTUM DEVICES, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 029445/0165 →