Granted Patent
Utility
US 6,620,731 · App. 10/035,355
Method for fabricating semiconductor components and interconnects with contacts on opposing sides
Inventors:
Warren M. Farnworth, Alan G. Wood, David R. Hembree
Patented Case
View Patent ↗
Granted: Sep 16, 2003
Filed: Jan 4, 2002
Inventors
Warren M. Farnworth
Alan G. Wood
David R. Hembree
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.